Packaging
An essential element in the successful commercial implementation of an ASIC design is the package selection.
SSSL offers a comprehensive range of package styles from high reliability ceramic packages to the latest micro plastic and MEMS package styles. Full custom packages have also been developed with our packaging partners.
Plastic packages
- Micro Lead Frame : MLP-QUAD, MLP MICRO
- Array : SSBGA, SSLGA, FTBGA, CBBGA
- Quad Flat Pack : MQFP, LQFP, TQFP
- Small Outline Package : SOIC, QSOP, SSOP, MSOP, TSSOP
- Plastic Dual In Line Packages : PDIP
- Plastic Leaded Chip Carrier : PLCC
Ceramic Packages
- Side Braze package
- Cerdip
- Pin Grid Array
- Chip Carrier
- CQFP
- Cerquad
