Text only | Text size: a A A | Accessibility


Packaging

An essential element in the successful commercial implementation of an ASIC design is the package selection.

SSSL offers a comprehensive range of package styles from high reliability ceramic packages to the latest micro plastic and MEMS package styles. Full custom packages have also been developed with our packaging partners.

Plastic packages

  • Micro Lead Frame : MLP-QUAD, MLP MICRO
  • Array : SSBGA, SSLGA, FTBGA, CBBGA
  • Quad Flat Pack : MQFP, LQFP, TQFP
  • Small Outline Package : SOIC, QSOP, SSOP, MSOP, TSSOP
  • Plastic Dual In Line Packages : PDIP
  • Plastic Leaded Chip Carrier : PLCC

Ceramic Packages

  • Side Braze package
  • Cerdip
  • Pin Grid Array
  • Chip Carrier
  • CQFP
  • Cerquad
COME AND MEET US
2009
26th - 28th May 2009, Nürnberg
16th International Trade Fair for Sensorics, Measuring and Testing Technologies with Concurrent Conferences.